LIGA is a German acronym for lithography, electroplating, and molding. It is a microfabrication technique that uses highly penetrating X-ray lithography to create extremely precise, high-aspect-ratio molds in thick polymer layers. These molds are then filled with metal via electroplating to produce tiny, robust mechanical parts like micro-gears, sensors, and optical components.
We're using a LIGA process to fabricate the microscopic copper coils for the new MEMS sensor.
Related terms
Wafer
A highly polished slice of semiconductor material used as the foundation for fabricating integrated circuits.
Layout
The physical arrangement of components and traces on a chip or circuit board.
Thin-film
Describes electronic components made by depositing microscopic layers of material onto a substrate.