Device layer transfer (DLT) involves building active electronic components on a source substrate, bonding that layer to a target substrate, and then removing the original backing. Foundries use this process to combine incompatible materials, such as placing high-performance logic on top of a specialized thermal or optical substrate, avoiding the thermal budgets that would ruin the bottom layer if grown directly.
We're using DLT to integrate the gallium nitride power stages directly onto the silicon control logic.
Also heard as
- device layer transfer
Related terms
Wafer
A highly polished slice of semiconductor material used as the foundation for fabricating integrated circuits.
Chiplet
A smaller, modular integrated circuit die designed to be combined with others in a single package.
Heterojunction
An interface between two different semiconductor materials with unequal bandgaps.