A high-density surface-mount package where the pins are replaced by a grid of solder balls on the underside of the chip. During assembly, the entire board is heated in a reflow oven, melting the balls to join the package pads to the PCB pads. This format allows for hundreds or thousands of connections in a small area and provides excellent thermal and electrical performance, but the hidden joints require X-ray inspection.
We need to X-ray the ball grid array on the new prototype because several memory data lines are failing.
Also heard as
- BGA
Related terms
Ballout
The specific assignment of signals to the grid of pins on a BGA package.
Reflow
Soldering surface mount parts by melting printed solder paste in an oven that follows a set temperature profile.
Head-in-pillow
BGA defect where a solder ball rests in melted paste but never fuses with it, leaving a hidden weak joint.
Reballing
The process of replacing the array of solder spheres on the bottom of a ball grid array package.