Pin Grid Array. A type of integrated circuit packaging where the bottom face is covered in a dense array of through-hole pins. PGAs are typically mounted in zero-insertion-force sockets rather than soldered directly to the board, making them common for replaceable processors.
Heard on the job
Check the orientation notch on the PGA before locking the socket lever down.
Do not mix it up with
- Ball grid array: A PGA uses rigid pins that go into a socket or through-holes, while a BGA uses solder balls that are reflowed directly to surface pads.
Related terms
Ball grid array
A surface-mount package type that uses a grid of solder balls beneath the component for electrical connections.
SMD
Surface-mount device, an electronic component designed to be soldered directly onto the surface of a circuit board.
Through-hole
Mounting method where component leads pass through plated holes and are soldered on the far side.