A rework procedure where the old, melted solder balls on a BGA component are removed, the pads are cleaned, and a new grid of solder spheres is attached using a stencil and flux. This is done to salvage expensive chips from defective boards, change the solder alloy, or prepare a part for a second reflow cycle.
The processor failed the X-ray inspection, so we need to pull it, do a full reballing, and place it again.
Reballing requires strict thermal profiling. Heating the chip too many times or too quickly will destroy the silicon or cause the package to warp.
Related terms
Ball grid array
A surface-mount package type that uses a grid of solder balls beneath the component for electrical connections.
Rework
Removing and replacing parts or fixing joints on an assembled board to correct defects or make changes.
Stencil
Thin laser-cut metal sheet used to print solder paste onto board pads before parts are placed.
Hot air
Hot-air rework station, or the technique of reflowing parts with a focused stream of heated air.