At wafer probe and final test, every die or packaged part is assigned a bin by the first test it fails, or by the grade it passes at. Bin 1 is typically fully good; other bins record failure types such as opens, shorts, leakage or speed, and some hold good parts sorted by performance grade. Bin paretos and bin wafer maps are the first data a yield engineer pulls when sort yield drops.
Bin 12 leakage fails tripled on the last five lots, mostly center die. Pull the gate oxide thickness data.
Also heard as
- test bin
Related terms
Wafer map
Picture of a wafer showing each die's test result or measurement by location, used to spot spatial failure patterns.
Yield
Fraction of units that come out good at a step or across a whole process, the headline number for any production line.
Sort
Either the wafer-level electrical test that bins every die, or a 100 percent inspection that screens suspect parts.
Killer defect
Defect that lands where it causes a die to fail, as opposed to a harmless cosmetic or nuisance defect.