Thermal design power

nounStandard termElectronics

The maximum amount of heat a cooling system must be able to dissipate from a chip under typical heavy workloads.

Often abbreviated as TDP, this metric defines the thermal envelope for a processor or component. It tells system builders the maximum continuous wattage the chip will reject as heat when running real-world applications. While not strictly the absolute peak power draw, exceeding the cooling solution's capacity for this value causes the chip to throttle its clock speeds to prevent physical damage.

Heard on the job

The new server rack is going to need better airflow because these CPUs have a thermal design power of 250 watts each.

Insider tip

TDP is a thermal metric, not an electrical one. A chip with a 65W TDP might briefly draw significantly more than 65 watts of electrical power during boost spikes.

Also heard as

  • TDP