Microelectronic modular assembly refers to the physical integration of various microelectronic components, such as bare IC dies, passive components, and interconnects, onto a single high-density substrate. This approach reduces parasitic inductance and capacitance by shortening trace lengths, while dramatically saving board space. It is heavily utilized in aerospace, military, and high-frequency RF applications where standard discrete packaging is too bulky.
Heard on the job
The radar transmit block uses a custom MMA to keep the RF path as short as possible between the power amplifier and the filter.